| 摘要: |
| TF线圈为大型“D”形轮廓，由高、中、低场线圈通过套装和堆叠而成。需要分别对高中低场线圈进行绝缘处理，套装后填充高中低场之间的间隙（10mm-120mm），包绕对地绝缘后，再对间隙填充层进行绝缘处理。为了充分验证绕组制造的工艺，采用一个以中场绕组尺寸的 Dummy 绕组进行真空压力浸渍（Vacuum Pressure Impregnation, VPI）完成线圈绝缘。针对VPI过程中真空环境、外部压力、固化温度、时间控制等技术难点，完成TF Dummy线圈VPI系统设计。采用CATIA软件对Dummy线圈VPI系统进行建模，合理设计子系统，有效提高VPI过程的时间，保证绝缘质量。通过每个子系统的理论分析计算，更精确的选择VPI系统配备的设备型号，为CFETR TF线圈VPI系统工程设计提供了理论和实践依据。 |
| 关键词: CFETR TF线圈 VPI系统 分析计算 |
| DOI： |
| 投稿时间：2023-05-11修订日期：2023-05-26 |
| 基金项目: |
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| Design of CFETR TF Dummy Coil VPI System |
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xuejianjian, wujiefeng, wenwei, wuyu, yanzhaohui, yuxiaowu, shangmingming
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| (Institute of Plasma Physics（ASIPP）) |
| Abstract: |
| TF coil is gigantic “D” shaped, composed by high, medium and low filed coil, via embedding and stacking.It is necessary to insulate the high, medium and low field coils respectively, fill the gap between high, medium and low fields (10mm-120mm) after embedding, wrap the ground insulation, and then insulate the gap filling layer.In order to fully validate the manufacturing process of the winding, a Dummy winding with a mid field winding size was used for vacuum pressure impregnation (VPI) to complete the coil insulation.To address technical difficulties such as vacuum environment, external pressure, curing temperature, and time control in the VPI process, complete the design of the TF Dummy coil VPI system.Using CATIA software to model the Dummy coil VPI system, designing subsystems reasonably, effectively improving the VPI process time and ensuring insulation quality.Through theoretical analysis and calculation of each subsystem, more accurate selection of equipment models equipped with the VPI system provides theoretical and practical basis for the engineering design of the CFETR TF coil VPI system. |
| Key words: CFETR TF Coil VPI system Analysis and calculation[] |